Micromachining Using Electrochemical Discharge Phenomenon

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Format: Hardcover
Pub. Date: 2009-04-17
Publisher(s): William Andrew Pub
List Price: $235.39

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Summary

This book presents an unconventional and largely unknown technology, which is able to micro-machine at relatively low cost glass, polymers and other materials. This process is called Spark Assisted Chemical Engraving (SACE), or Electro Chemical Discharge Machining (ECDM). First presented in 1968 in Japan by Kurafuji and Suda, this technology was studied essentially in the academic world and mainly applied for micro-fluidic devices. This book explains the fundamentals of SACE, promotes the technology, and encourages researchers and engineers from industry to use it for their specific applications. Therefore, the book, after presenting in details the fundaments of SACE (in particular the Electrochemical Discharges), deals mainly with practical aspects of implementing the machining technology. The book is written so that researchers from fields other than micro-technology (e.g., from life science) will be able to build a simple machining set-up, together with his mechanical work-shop, for individual needs.

Author Biography

Rolf Wuumlet;thrich is an Assistant Professor in the Department of Mechanical and Industrial Engineering at Concordia University, Montreal. His research includes: micromachining of glass and ceramics by non-traditional processes (fundamental aspects, modeling and simulation); development of microdevices for microfluidic, Lab on a Chip, microfuel cells and biosensors; and fabrication of nano-particles using electrochemical discharges. Dr. Wuumlet;thrich has published over 50 peer-reviewed journal and conference papers in his research field of micromachining of glass using electrochemical discharges, and has been invited to give keynotes in international conferences.

Table of Contents

Series Editor's Prefacep. xi
Prefacep. xiii
Machining with Electrochemical Discharges-An Overviewp. 1
Spark-Assisted Chemical Engravingp. 2
What is Sace?p. 2
Machining Examplesp. 3
A Short Historical Overviewp. 5
Sace as a Micromachining Technologyp. 6
Mechanical Machiningp. 7
Chemical Machiningp. 7
Thermal Machiningp. 8
Scope of the Bookp. 8
Electrochemical Dischargesp. 11
Historical Overview of Electrochemical Dischargesp. 13
Discovery and Early Applicationsp. 13
The Wehnelt Interrupterp. 15
Spectrum of the Electrochemical Dischargesp. 21
Nature of the Electrochemical Dischargesp. 22
Townsend Dischargesp. 23
Arc Dischargesp. 27
Electrochemical Dischargesp. 29
Contact Glow Discharge Electrolysisp. 29
Glow Discharge Electrolysisp. 30
Anodic Contact Glow Discharge Electrolysisp. 32
Cathodic Contact Glow Discharge Electrolysisp. 33
Gas Evolving Electrodesp. 35
Introduction to Electrochemistryp. 35
The Nernst Equationp. 35
Electrochemical Cell Out of Thermodynamic Equilibriump. 37
The Charge Transfer Current Characteristicsp. 40
Hydrogen and Oxygen Evolutionp. 41
Electrical Conductivity in Electrolytesp. 43
Bubble Formation during Electrolysisp. 44
Bubble Layerp. 47
The Bubble Diffusion Regionp. 49
The Bubble Adherence Regionp. 51
Clusters and Bubblesp. 52
Percolation Theoryp. 52
The Infinite Cluster and Percolation Thresholdp. 55
Model of the Bubble Adherence Regionp. 57
Bubble Evolution on a Gas Evolving Electrodep. 59
Mean Stationary Current - Voltage Characteristicsp. 61
Experimental Descriptionp. 62
Theoretical Descriptionp. 63
The Gas Film-A Key Elementp. 69
Formation of the Gas Filmp. 69
Gas Film Formation by Local Electrolyte Evaporationp. 70
Gas Film Formation by Electrochemical Gas Evolutionp. 74
Critical Voltage as a Random Variablep. 75
Influence of the Electrode Geometryp. 75
Influence of the Electrolyte Concentrationp. 76
Gas Film Formation Timep. 77
Hybrid Mechanismsp. 80
Shape of the Gas Filmp. 81
Discharge Activity Inside the Gas Filmp. 83
Definition of the Modelp. 84
Probability Distribution of Electrochemical Dischargesp. 84
Probability of Discharge as a Function of the Terminal Voltagep. 86
Current Evolution Equationp. 89
Mean Current and Fluctuations in the Currentp. 90
Controlling the Gas Filmp. 92
Reducing the Critical Voltagep. 92
Controlling the Gas Film Stabilityp. 93
Controlling the Gas Film Shapep. 94
Micromachining with Electrochemical Dischargesp. 95
Material Removal Mechanismp. 97
General Considerationsp. 97
Machining at Low Depthsp. 100
Thermal Modelp. 100
Material Removal Ratep. 103
Application to Glass Micromachiningp. 105
Application to Ceramic Micromachiningp. 107
Machining at High Depthsp. 107
Chemical Contributionsp. 110
Summaryp. 112
Common Machining Strategiesp. 115
General Overviewp. 115
Gravity-Feed Drillingp. 116
Discharge Regimep. 118
Hydrodynamic Regimep. 119
Repeatability of Drillingp. 120
Drilling Timep. 120
Influence of the Inter-electrode Resistancep. 121
Microhole Dimensionsp. 122
Machining Qualityp. 125
Constant Velocity Feed Drillingp. 127
2D and 3D Machiningp. 128
Quality of Machined Microchannelsp. 129
Maximal Allowed Tool Travel Speedp. 132
Depth of Machined Microchannelsp. 133
Influence of Tool Distance from Workpiecep. 134
Wire Electrochemical Discharge Machiningp. 135
Controlling the Machining Processp. 137
Process Analysisp. 137
Promoting Chemical Etchingp. 138
Effect of Tool-Electrode Shapep. 139
Effect of Tool-Electrode Vibrationp. 140
Effect of Tool-Electrode Rotationp. 143
Adding Abrasive to the Electrolytep. 144
Controlling the Heat Generatedp. 144
Influencing the Heat Transferp. 145
Heat Transfer through the Electrolytep. 145
Heat Transfer through the Tool-Electrodep. 146
Reducing the Critical Voltagep. 147
Pulsed Voltage Machiningp. 148
Microhole Drillingp. 148
2D and 3D Machiningp. 149
Travelling Wire Electrochemical Discharge Machiningp. 152
Controlling the Tool-Workpiece Gapp. 152
Searching for Process Control Signalsp. 153
Summaryp. 155
Designing a Sace Micromachining Set-upp. 157
General Design Rulesp. 157
Electrodesp. 157
Processing Cellp. 159
Electrolytep. 159
Power Supplyp. 159
Drilling Set-upsp. 160
Manual Drillingp. 160
Constant Feed Drillingp. 160
Gravity-Feed Drillingp. 161
2D Machining Set-upsp. 162
Outlookp. 165
Referencesp. 167
Indexp. 173
Table of Contents provided by Ingram. All Rights Reserved.

Excerpts

Series Editor Preface The possibility of modifying materials using electrical discharges has fascinated mankind ever since he observed the results of lightning striking objects in nature. We do not, of course, know when the first observation took place, but we may be reasonably sure that it was a sufficiently long time ago that many millennia had to pass before electricity was "tamed", and subsequently put to work modifying materials in a systematic, "scientific" way-as exemplified by Humphrey Davy's electrolysing common salt to produce metallic sodium at the Royal Institution in London. But these are essentially faradaic processes (named after Davy's erstwhile assistant Michael Faraday), and such processes are also used extensively today for (micro) machining, as exemplified by electrochemical machining (ECM). They are relatively well known, and are applicable to conducting workpieces. Far less well known is the technology of what is now called spark-assisted chemical engraving (SACE), in which the workpiece is merely placed in the close vicinity of the pointed working electrode, and is eroded by sparks jumping across the gas bubbles that develop around the electrode to reach the electrolyte in which everything is immersed, the circuit being completed by the presence of a large counterelectrode. This technology can therefore be equally well used for workpieces made from nonconducting materials such as glass, traditionally difficult to machine, especially at the precision micro level needed for such applications as microfluidic mixers and reactors. The development of attractive machining technologies such as SACE is in itself likely to play a decisive part in the growth of microfluidics-based methods in chemical processing and medical diagnostics, to name just two important areas of application. Since, as the author very correctly points out, knowledge about nonfaradaic electrochemical machining methods is presently remarkably scanty within the microsystems community, this book is conceived as a comprehensive treatise, covering the entire field, starting with a lucid explanation of the physico-chemical fundamentals, and ending with a thorough discussion of the practical questions likely to be asked, and an authoritative exposition of the means to their resolution. I therefore anticipate that this book will significantly contribute to enabling the rapid growth of micromachining of nonconducting materials, for which there is tremendous hitherto unexploited potential.

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